According to Bloomberg, Samsung plans to begin using the advanced semiconductor manufacturing gear by 2028, while TSMC expects to follow in 2030.
These machines, which cost approximately $400 million each, use extreme ultraviolet light to print the incredibly small and complex patterns required for the next generation of chips.
This agreement is critical for the global supply of high-performance hardware used in artificial intelligence (AI).
As the world’s leading manufacturer of memory chips, Samsung’s adoption of the technology will influence the future of data storage and processing, while TSMC’s move impacts its major clients, including Nvidia and Apple.
By securing commitments from these industry leaders, ASML reinforces its role as the primary provider of the infrastructure necessary to meet the rising demand for more powerful AI processors.
The transition to this new equipment involves a broader industry shift toward 12-inch masks—templates used to transfer circuit designs onto silicon wafers—to support more efficient chip production.
While Intel had already moved to integrate these machines, the inclusion of Samsung and TSMC ensures that the most prominent players in the semiconductor market are aligned on the future technical standards for AI chip fabrication.
This collective investment highlights the significant capital expenditure required to maintain a competitive edge in the rapidly evolving technology sector.