The US race to break TSMC’s advanced chip packaging grip
- Source
- New York Times
- Time
- 6:45 AM
- Weight
- 94/100
The United States is intensifying efforts to develop domestic advanced chip packaging capabilities, a critical stage in semiconductor manufacturing that has become a major bottleneck in the AI era. Currently, TSMC maintains a significant lead in this technology, particularly with its proprietary processes essential for high-end AI processors.
Because the vast majority of this sophisticated assembly takes place in Taiwan, US officials and industry leaders are increasingly concerned about supply chain vulnerabilities and the geopolitical risks associated with such concentrated production. To bridge this gap, the US government is utilizing the CHIPS Act to fund domestic packaging facilities and research.